Harris® Dynaflow® Phos-Copper Brazing Alloy .050" x 20" (28 pk)

APPLICATIONS

Dynaflow® is an exceptionally pure phosphorus-copper-silver brazing filler metal recommended for all copper-to-copper and copper-to-brass cooling applications. This alloy has provided decades of serviceability and economics to the customers. Dynaflow® is a premium, medium range silver alloy developed to mirror the performance characteristics of the 15% Silver brazing filler metals. It is an excellent alloy for brazing both tight and loose fitted applications. It is a leading choice for operators, service technicians, and end users. Conforms to the EU Reach & RoHS directive.

FEATURES

• Premium, medium-range alloy for brazing copper or brass.
• Excellent strength and ductility
• Economical replacement of 15% Silver alloys
• When heated quickly to its liquidus, allows penetration into tight clearance connections
• Wide melting range provides ability to fill loose connections and "cap" or "build up" around the finished joint
• Self-fluxing on copper and copper-to-copper connections. Use Stay-Silv® white flux for brazing brass or copper-to brass
• Not recommended for brazing steel or other ferrous base metals
• Corrosion resistance is generally similar to the copper base metal, but phosphorus containing alloys, including Dynaflow®, should not be used if the braze is exposed to sulfur or sulfur compounds in service
• Phosphorus content promotes formation of low ductility intermetallic with the base metal
• Conforms to the EU Reach & RoHS directive

NOMINAL CHEMICAL COMPOSITION %:
Silver: 5.5 - 6.5
Phosphorus: 5.9 - 6.2
Copper: Remainder
Other (Total): 0.15

TYPICAL PHYSICAL PROPERTIES:
Solidus: 1190ºF (643°C)
Liquidus: 1470°F (799°C)
Density: 0.305 (lb./cu.in)
Electrical conductivity: 8.80 (% IACS)